-
1 heat-sink dual in-line package
= HDIPEnglish-Russian electronics dictionary > heat-sink dual in-line package
-
2 heat-sink dual in-line package
плоский корпус с двусторонним расположением выводов и радиатором ( образованным путём объединения группы выводов), корпус типа HDIP, HDIP-корпусThe New English-Russian Dictionary of Radio-electronics > heat-sink dual in-line package
-
3 package
1) упаковка (1. упакованный предмет или группа предметов 2. товарная единица 3. упаковочный материал; тара; контейнер; капсула; коробка; ящик) || упаковывать, помещать в упаковку; укладывать2) корпус (напр. ИС) || корпусировать, помещать в корпус; изготавливать в корпусе3) блок; узел; модуль; сборка4) пакет (напр. компьютерных программ); блок (напр. телевизионных программ) || формировать пакет(ы) (напр. компьютерных программ), пакетировать; компоновать блок (напр. телевизионных программ)6) (полностью) укомплектованное программное обеспечение ( для розничной торговли); стандартное программное обеспечение•- all-metal package
- area array surface mounted package
- ball-grid array package
- beam-lead package
- beam-lead integrated circuit package
- benchmark package
- bottom-brazed package
- bubble package
- CAD package
- cartridge package
- ceramic-and-metal package - ceramic pin-grid array package - chip package - command-driven package
- computer-aided design package
- control package
- cordwood package
- deca-watt package
- deca-watt I-leads package
- double-prong package - FEB package
- flangeless package
- flange-sealed package
- flat package
- flat package G
- flat surface mounted package
- functional electronic block package
- graphics package
- guidance package - high-energy leadless package
- high thermal plastic-ball grid array package
- inserted package
- integrated-circuit package
- integrated program package - micro ball-grid array package
- microcircuit package
- microepoxy package - modular accounting package
- multichip package
- multilayer molded package
- pancake package
- peripheral-leaded package
- pill package - sensory package - single-chip package - single-prong package
- skinny dual in-line package
- small outline package
- small outline J-leaded package
- small outline large package
- small outline transistor package
- small vertical package
- socket mounted package
- software package
- software compression-decompression package
- standard package
- standard inserted package
- statistical package for social sciences
- stripline package
- stud package
- subroutine package - surface vertical package
- tape carrier package
- telemetering package - top-brazed package
- transistor-outline package -
4 package
1) упаковка (1. упакованный предмет или группа предметов 2. товарная единица 3. упаковочный материал; тара; контейнер; капсула; коробка; ящик) || упаковывать, помещать в упаковку; укладывать2) корпус (напр. ИС) || корпусировать, помещать в корпус; изготавливать в корпусе3) блок; узел; модуль; сборка4) пакет (напр. компьютерных программ); блок (напр. телевизионных программ) || формировать пакет(ы) (напр. компьютерных программ), пакетировать; компоновать блок (напр. телевизионных программ)5) набор; комплект (напр. оборудования) || изготавливать или поставлять в виде набора или комплекта6) (полностью) укомплектованное программное обеспечение ( для розничной торговли); стандартное программное обеспечение•- all-metal package
- area array surface mounted package
- ball-grid array package
- beam-lead integrated circuit package
- beam-lead package
- benchmark package
- bottom-brazed package
- bubble package
- CAD package
- cartridge package
- ceramic dual in-line package
- ceramic pin-grid array package
- ceramic quad flat package
- ceramic-and-metal package
- ceramic-glass-metal package
- chaff package
- chip package
- chip scale package
- coaxial package
- command-driven package
- computer-aided design package
- control package
- cordwood package
- deca-watt I-leads package
- deca-watt package
- double-prong package
- dual flat package with flat leads
- dual flat package
- dual in-line package
- FEB package
- flangeless package
- flange-sealed package
- flat package G
- flat package
- flat surface mounted package
- functional electronic block package
- graphics package
- guidance package
- heat-sink dual in-line package
- heat-sink quad flat package
- heat-sink single in-line package
- heat-sink small outline package
- heat-sink zigzag in-line package
- hermetic package
- high thermal plastic-ball grid array package
- high-energy leadless package
- inserted package
- integrated program package
- integrated-circuit package
- low-profile quad flat package
- metal electrode face bonded package
- micro ball-grid array package
- micro small outline package
- microcircuit package
- microepoxy package
- microwave package
- modular accounting package
- multichip package
- multilayer molded package
- pancake package
- peripheral-leaded package
- pill package
- plastic dual in-line package
- plastic quad flat package
- plastic small outline package
- plug-in package
- power flat package
- program package
- quad flat package with flat leads
- quad flat package with J-leads
- quad flat package
- quad in-line package
- radar package
- rectangular single in-line package
- self-contained package
- sensory package
- shrink dual in-line package
- shrink inserted package
- shrink single in-line package
- shrink small outline large package
- shrink small outline package
- shrink zigzag in-line package
- side-brazed package
- single edge processor package
- single in-line package
- single-chip package
- single-prong package
- skinny dual in-line package
- small outline J-leaded package
- small outline large package
- small outline package
- small outline transistor package
- small vertical package
- socket mounted package
- software compression-decompression package
- software package
- standard inserted package
- standard package
- statistical package for social sciences
- stripline package
- stud package
- subroutine package
- surface horizontal package
- surface mount device package
- surface mount discrete package
- surface mounted package
- surface vertical package
- tape carrier package
- telemetering package
- thin quad flat package
- thin shrink outline L-leaded package
- thin small outline package I
- thin small outline package II
- thin small outline package
- TO package
- top-brazed package
- transistor-outline package
- ultra thin profile quad flat package
- ultra thin quad flat package
- very shrink pitch quad flat package
- windowed dual in-line package
- windowed small outline package
- zigzag in-line packageThe New English-Russian Dictionary of Radio-electronics > package
-
5 HDIP
= heat-sink dual in-line packageплоский корпус с-двусторонним расположением выводов и-радиатором, корпус типа HDIP, HDIP-корпус -
6 HDIP
сокр. от heat-sink dual in-line packageплоский корпус с двусторонним расположением выводов и радиатором, корпус типа HDIP, HDIP-корпусThe New English-Russian Dictionary of Radio-electronics > HDIP
См. также в других словарях:
Dual in-line package — PDIP redirects here. PDIP may also refer to Indonesian Democratic Party – Struggle. Three 14 pin (DIP14) plastic dual in line packages containing IC chips … Wikipedia
Chip carrier — A standard sized 8 pin dual in line package (DIP) containing a 555 timer IC. A chip carrier, also known as a chip container or chip package, is a container for a transistor or an integrated circuit. The carrier usually provides metal leads, or… … Wikipedia
Prozessorgehäuse — ICs in DIP Gehäusen Die Ummantelung eines (ungehäusten) Halbleiterchips (ein sog. Die) inklusive der Anschlussstellen (Leads, Pins oder Balls) bezeichnet man als Gehäuse oder Package. Es existieren zahlreiche Variationen solcher Gehäuse, die sich … Deutsch Wikipedia
Schaltkreisgehäuse — ICs in DIP Gehäusen Die Ummantelung eines (ungehäusten) Halbleiterchips (ein sog. Die) inklusive der Anschlussstellen (Leads, Pins oder Balls) bezeichnet man als Gehäuse oder Package. Es existieren zahlreiche Variationen solcher Gehäuse, die sich … Deutsch Wikipedia
Chipgehäuse — ICs in DIP Gehäusen Die Ummantelung eines (ungehäusten) Halbleiterchips (eines Die) inklusive der Anschlussstellen (Leads, Pins oder Balls) bezeichnet man als Gehäuse oder Package. Es existieren zahlreiche Variationen solcher Gehäuse, die sich in … Deutsch Wikipedia
List of electronics topics — Alphabetization has been neglected in some parts of this article (the b section in particular). You can help by editing it. This is a list of communications, computers, electronic circuits, fiberoptics, microelectronics, medical electronics,… … Wikipedia
Commodore 64 — Type Home computer Release date August 1982[1] Discontinued … Wikipedia
Light-emitting diode — LED redirects here. For other uses, see LED (disambiguation). Light emitting diode Red, pure green and blue LEDs of the 5mm diffused type Type Passive, optoelectronic Working principle Electr … Wikipedia
Vacuum tube — This article is about the electronic device. For experiments in an evacuated pipe, see free fall. For the transport system, see pneumatic tube. Modern vacuum tubes, mostly miniature style In electronics, a vacuum tube, electron tube (in North… … Wikipedia
Pentium III — Produced From early 1999 to 2003 Common manufacturer(s) Intel Max. CPU … Wikipedia
Electric motor — For other kinds of motors, see motor (disambiguation). For a railroad electric engine, see electric locomotive. Various electric motors. A 9 volt PP3 transistor battery is in the center foreground for size comparison. An electric motor converts… … Wikipedia
